Our Liquid Crystal Polymer LCP Injection Molding Services

Elevate precision manufacturing for high-tech applications with our LCP Injection Molding services—where the ultra-low viscosity and thermal stability of Liquid-crystal polymer (LCP) meet micro-scale engineering excellence. From 5G mmWave connectors to surgical micro-catheters, we deliver parts with unmatched thin-wall capabilities and high-frequency performance, backed by expertise in optimizing thermotropic mesomorphic behavior for critical industries.​

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Definition: Understanding LCP Injection Molding

LCP Injection Molding is the process of shaping Liquid-crystal polymer (LCP)—a unique engineering plastic with thermotropic mesomorphic behavior (forms ordered liquid-crystal structures when melted)—into high-precision components via injection molding. LCP stands out as a high-flow engineering resin that excels in ultra-thin-wall and micro-sized parts, making it the material of choice for industries demanding miniaturization and reliability. Below is a breakdown of key definitions, specifications, and comparisons to similar high-performance plastics:​

Core Specifications & Standards​

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LCP vs. PPS/PEEK (Key Competitors)​

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Our service scope covers end-to-end LCP molding—from material selection (per ASTM D5138 grade) to post-processing—ensuring parts meet the strictest precision and performance standards.

Our Capabilities: Mastering Micro-Scale LCP Molding

At Yigu Technology, our LCP Injection Molding capabilities are engineered to unlock LCP’s unique potential for ultra-precise, high-performance parts. We invest in specialized equipment and expertise to handle LCP’s high-flow, high-temperature requirements, even for the most demanding micro-components. Below is a detailed overview of our core capabilities:​

Core Capabilities Overview​

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Our in-house DfM + mold-flow (Design for Manufacturability) support also ensures your LCP part designs are optimized for molding—reducing tooling revisions and accelerating time to market.

Process: Step-by-Step LCP Injection Molding

LCP’s unique thermotropic mesomorphic behavior and ultra-low viscosity require a highly controlled injection molding process. Even minor deviations in temperature, speed, or pressure can compromise part precision or cause defects like weld lines. Below is our optimized process, designed to maximize consistency and performance:​

Step 1: Material Preparation (Drying)​

LCP absorbs minimal moisture (0.02% max), but even trace amounts cause surface defects (e.g., splay). We dry LCP pellets in a dehumidifying dryer at 150 °C for 4 hours (target moisture content: <0.01%). For halogen-free or medical-grade LCP, we use nitrogen-purged dryers to prevent contamination.​

Step 2: Mold Design & Preparation​

• Hot-Runner Optimization: We use multi-cavity hot runners with balanced flow channels to ensure uniform LCP distribution—critical for high-cavitation up to 128-fold molds. Gates are placed to minimize weld lines (a common LCP defect).​

• Mold Temperature Control: Molds are heated to 100–140 °C (via electric heaters) to promote LCP’s liquid-crystal orientation, which enhances part strength and dimensional stability. For thin-wall parts, we use conformal cooling to avoid uneven cooling.​

Step 3: Machine Setup​

• Barrel Temperature Profile: Barrel zones are set to a precise gradient to melt LCP without degradation:​

• Feed zone: 320 °C (softens pellets)​

• Melt zone: 340–350 °C (maintains mesophase flow)​

• Nozzle: 350–360 °C (prevents solidification)​

• High-Shear Screw: Our screws have shallow flights and high rotation speed (150–200 RPM) to generate shear, which enhances LCP’s flowability and orientation.​

Step 4: Injection & Packing​

• Fast Injection (1,000 mm/s): LCP’s ultra-low viscosity allows extremely fast injection—critical for filling ultra-thin-wall (0.05 mm) cavities before cooling. Slow injection causes short shots or uneven flow.​

• Low Back-Pressure: We use low back-pressure (5–10 bar) to avoid breaking LCP’s liquid-crystal structure, which preserves part strength.​

• Gate-Seal Optimization: We adjust injection pressure to ensure proper gate sealing (prevents flash, which is hard to remove from micro-parts).​

Step 5: Cooling & Demolding​

Cooling time is short (5–10 s) due to LCP’s fast crystallization. We use controlled cooling to maintain dimensional accuracy—too fast, and parts warp; too slow, and cycle times increase. Demolding uses soft, precision ejectors to avoid damaging delicate features (e.g., 0.1 mm pitch pins in DDR5 sockets).​

Step 6: Post-Processing & Quality Control​

• Post-Anneal Stress Relief: Parts are heated to 180–200 °C for 30–60 minutes to relieve internal stresses, improving dimensional stability by 25–30%.​

• Weld-Line Minimization: For parts with critical strength requirements (e.g., gears), we use laser welding to reinforce weld lines.​

• Cavity-Pressure Trace: We log cavity pressure data for every part, enabling traceability and process optimization.​

Vision 100% Inspection: All parts undergo AOI to check for defects (flash, short shots, dimensional 偏差) and ensure compliance with specs.

Materials: Choosing the Right LCP Grade for Your Project

LCP is available in various grades, each formulated to enhance specific properties (flowability, strength, weld resistance). The right grade depends on your application’s needs—whether you require ultra-thin walls, high-frequency performance, or biocompatibility. Below is a guide to the most common LCP grades we use:​

Popular LCP Grades & Their Uses​

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Grade Selection Checklist​

1. Thin-Wall Requirement: For <0.1 mm walls (e.g., 5G mmWave connectors), choose high-flow grades (Vectra E130i).​

2. High-Frequency Performance: For 5G/6G (28–90 GHz), select low-dielectric-loss grades (Sumikasuper E5008T).​

3. Medical Use: Choose halogen-free, biocompatible grades (custom formulations meeting ISO 10993).​

4. Dimensional Stability: For parts matching ceramic/metal (e.g., RF filters), pick mineral-filled LCP (CTE-matched).​

We have direct Celanese & Polyplastics supply agreements, ensuring consistent access to top LCP grades—even for high-volume orders.

Surface Treatment: Enhancing LCP Part Performance

LCP’s inherent properties (chemical resistance, high temperature stability) are exceptional, but surface treatment can expand its capabilities—whether you need conductivity, biocompatibility, or EMI shielding. Below are the most effective surface treatments for LCP parts:​

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For example, we use electro-less Ni/Au on DDR5 sockets to ensure reliable electrical contact, and laser ablation on surgical micro-catheters to create precise fluid channels for drug delivery.

Advantages: Why LCP Injection Molding Outperforms Alternatives

LCP Injection Molding offers unique advantages that make it irreplaceable for micro-scale, high-performance applications. Compared to PPS, PEEK, and ceramics, LCP delivers unmatched value for miniaturized, high-frequency, and high-heat parts:​

• Ultra-Low Viscosity: LCP’s melt viscosity is 5–10x lower than PPS/PEEK, enabling ultra-thin-wall parts down to 0.05 mm and 0.1 mm pitch capability (dense pin grids in connectors). No other plastic can match this for miniaturization.​

• High-Frequency Dielectric Performance: LCP has ultra-low dielectric loss (Df <0.002 at 10 GHz) and stable dielectric constant (Dk ≈3.0), making it the top choice for 5G/6G RF components (e.g., mmWave connectors, coax filters) that require minimal signal loss.​
• Extreme Thermal Stability: With 300 °C HDT, LCP maintains strength in high-heat​ environments (e.g., automotive engine bays, 5G base station amplifiers) without warping or losing strength. This outperforms PPS (HDT: 260 °C) and matches PEEK (HDT: 300 °C) at a lower cost for non-implant applications.​
• CTE Matched to Ceramic: Mineral-filled LCP has a coefficient of thermal expansion (CTE) of 5–8 × 10⁻⁶/°C—nearly identical to ceramic substrates (6 × 10⁻⁶/°C). This eliminates thermal stress in multi-material assemblies (e.g., RF filters with ceramic cores), a problem that plagues PPS/PEEK (CTE 15–20 × 10⁻⁶/°C).​

• Chemical Inertness: LCP resists oils, solvents, acids (pH 2–12), and bases—similar to PEEK but with better flowability. It’s also resistant to harsh cleaning agents, making it ideal for medical devices (e.g., surgical catheters) and industrial sensors.​

• Radiation Sterilizable: LCP withstands gamma radiation (25 kGy) and ethylene oxide (ETO) sterilization—critical for reusable medical tools (e.g., insulin pump components) that need frequent disinfection. Unlike some plastics (e.g., PVC), it doesn’t become brittle after sterilization.​

• Minimal Flash: LCP’s high flow and fast solidification reduce flash (excess material) to <0.01 mm—far less than PPS/PEEK. This eliminates costly post-processing (trimming), a major advantage for high-volume micro-parts (e.g., 5G connectors).​

• Fast Cycle <10 s: LCP’s fast crystallization (due to its liquid-crystal structure) cuts cycle times to 5–10 seconds—2–4x faster than PPS (15–30 s) and PEEK (20–40 s). For high-volume parts (e.g., DDR5 sockets), this triples production output and lowers unit costs.​

Metal & Ceramic Replacement: LCP is 50–70% lighter than metal (aluminum/steel) and 30–40% lighter than ceramic. It also costs 20–30% less than ceramic for complex shapes (no sintering needed). For example, replacing metal 5G connector shells with LCP cuts weight by 60% and cost by 25%.

Applications Industry: Where LCP Injection Molding Shines

LCP Injection Molding dominates industries that demand miniaturization, high-frequency performance, and reliability in harsh conditions. From 5G networks to life-saving medical devices, LCP solves problems no other material can. Below’s how key sectors leverage LCP:​

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A standout example: In 5G mmWave connectors, LCP’s ability to mold 0.08 mm thin walls and maintain low dielectric loss at 90 GHz makes it the only material that can meet the industry’s miniaturization and performance goals. Ceramic connectors are too brittle, and PPS can’t handle the frequency or thinness.

Case Studies: Real-World Success with LCP Injection Molding

Our LCP Injection Molding services have helped clients across high-tech industries overcome miniaturization and performance challenges—from launching 5G networks to improving patient care. Below are detailed case studies with measurable results:​

Case Study 1: 0.08 mm 5G mmWave Connector (90 GHz, 40% Cost-Down)​

• Challenge: A telecom equipment maker needed a 5G mmWave connector (28–90 GHz) with 0.08 mm thin walls (to fit in small base stations) and dielectric loss <0.003. The existing ceramic connector was brittle (5% failure rate during assembly), heavy (10g), and expensive ($15/unit).​

• Solution: We used Vectra E130i (high-flow LCP) for its low dielectric loss and ultra-thin-wall capability. Our 0.05 mm thin-wall molding process filled the 0.08 mm cavities, and electro-less Ni/Au plating ensured reliable electrical contact. We also used a 32-cavity hot-runner mold to boost production.​

• Result: The LCP connector weighed just 3g (70% lighter than ceramic), had a failure rate <0.1% (vs. 5% for ceramic), and cost $9/unit (40% cost-down). It maintained dielectric loss <0.002 at 90 GHz—exceeding the client’s requirement. The client scaled to 100,000 connectors/month, with our vision 100% inspection ensuring zero defects.​

• Customer Testimonial: “LCP let us shrink our 5G base stations by 30%. The connector’s performance at 90 GHz is unmatched—we’re now using LCP for all our mmWave components.” — Telecom Engineering Director​

Case Study 2: 64-Cavity DDR5 Socket (7 s Cycle, 3x Output)​

• Challenge: A semiconductor company needed a DDR5 memory socket with 0.1 mm pitch pins (128 pins total) and ±5 µm true-position. The existing PPS socket had slow cycle times (25 s) and poor pin alignment (15% rejected), limiting production to 10,000 units/month.​

• Solution: We selected Zenite 6130 (glass-filled LCP) for its precision and low warpage. Our 64-cavity hot-runner mold (high-cavitation up to 128-fold) and fast injection (1,000 mm/s) cut cycle time to 7 seconds. We also used in-house CT scanning to verify pin alignment (±3 µm, better than the ±5 µm requirement).​

• Result: The LCP socket had a rejection rate <1% (vs. 15% for PPS) and production jumped to 30,000 units/month (3x output). Pin alignment was consistent (±3 µm), meeting the client’s strict semiconductor standards. Unit cost dropped by 35% (from ​8to5.20) due to faster cycles and lower scrap.​

Case Study 3: Surgical Micro-Catheter Tip (5 Fr, Radiation Sterilizable)​

• Challenge: A medical device company needed a 5 Fr (1.67 mm diameter) micro-catheter tip with 0.05 mm thin walls (to deliver drugs to small blood vessels) and compatibility with gamma sterilization. The existing Teflon tip was too stiff (damaged blood vessels) and couldn’t be laser-ablated for fluid channels.​

• Solution: We used halogen-free LCP (biocompatible, ISO 10993) for its flexibility and sterilization resistance. Our 0.05 mm thin-wall molding created the ultra-small tip, and laser ablation added 0.01 mm fluid channels (for drug delivery). Production took place in our clean-room ISO 7 to avoid contamination.​

• Result: The LCP tip was flexible (reduced vessel damage by 80% vs. Teflon) and withstood 50+ gamma sterilization cycles (no brittleness). It fit through 5 Fr catheters—smaller than the client’s 6 Fr target—enabling treatment of previously inaccessible blood vessels. The company received FDA clearance 3 months ahead of schedule.​

Case Study 4: RF Filter (28 GHz, Insertion Loss <0.2 dB)​

• Challenge: An aerospace client needed an RF filter for satellite communication (28 GHz) with insertion loss <0.2 dB and compatibility with extreme temperatures (-40°C to 150°C). The existing metal filter was heavy (200g) and had insertion loss of 0.5 dB (too high for satellite signals).​

• Solution: We used mineral-filled LCP (CTE matched to ceramic) to pair with the filter’s ceramic core (no thermal stress). Our in-house mold-flow optimized the filter’s internal cavities for uniform LCP flow, and PVD sputtering added EMI shielding. We also tested the filter in temperature chambers to validate performance.​

Result: The LCP filter weighed 60g (70% lighter than metal) and had insertion loss of 0.15 dB (well below the 0.2 dB target). It operated reliably across -40°C to 150°C and passed aerospace fire safety tests (UL 94 V-0). The client integrated it into 500 satellites, with zero failures in 2 years.

Why Choose Us: Your Trusted LCP Injection Molding Partner

LCP Injection Molding requires specialized expertise—LCP’s unique liquid-crystal behavior and micro-scale requirements leave no room for error. Here’s why clients in telecom, medical, and automotive industries choose our services:​

1. Industry-Leading Certifications & Quality​

We hold IATF 16949 (automotive) and ISO 13485 (medical) certifications—ensuring compliance with the strictest standards for high-reliability industries. Our clean-room ISO 7 facility meets FDA cGMP (21 CFR Part 820) for medical device production, and we maintain a zero-defect PPM <50 (parts per million) quality standard—critical for semiconductor and aerospace clients. We also provide full traceability (material batches, production data) for every part.​

2. Specialized LCP Expertise & Equipment​

• 300+ LCP Molds Built Annually: We design and manufacture over 300 custom LCP molds each year—more than most competitors—including high-cavitation up to 128-fold hot-runner molds and micro-molding tools for 0.05 mm thin walls. Our molds are optimized for LCP’s flow behavior (balanced runners, precision gates) to minimize defects.​

• 400 °C Electric Presses: Our fleet of 30 electric injection molding machines is specially modified for LCP—with fast injection (up to 1,000 mm/s), high-shear screws, and ±1 °C temperature control. This ensures consistent melting and filling for micro-parts.​

• In-House DfM + Mold-Flow: Our engineers use advanced mold-flow software to simulate LCP flow, warpage, and weld lines before tooling. We also offer DfM support to optimize part designs (e.g., adding draft angles, reducing undercuts) — cutting tooling revisions by 50% and saving 4–6 weeks of development time.​

3. Speed & Global Reach​

• 48-Hour T1 Samples: We deliver first-article samples (T1) in 48 hours for most LCP projects—using high-temperature 3D printing (for prototypes) and rapid tooling (for injection-molded samples). This accelerates design validation and time to market.​

• Direct Celanese & Polyplastics Supply: We have exclusive partnerships with LCP leaders Celanese (Vectra) and Polyplastics (Sumikasuper)—ensuring priority access to high-demand grades (e.g., Vectra E130i, Sumikasuper E5008T) even during material shortages. This guarantees consistent lead times (4–6 weeks for production runs).​

• Global Logistics Hubs: We have logistics hubs in Asia, Europe, and North America—enabling fast delivery (2–5 days) to clients worldwide. We also handle customs and regulatory compliance (e.g., FDA import for medical parts) to avoid delays.​

4. Security & Sustainability​

• IP-Secure Clean-Room: Our cleanrooms have restricted access (biometric locks) and encrypted data systems to protect client intellectual property (e.g., 5G connector designs, medical device blueprints). We also sign strict NDAs for all custom projects.​

• Sustainable Manufacturing: We recycle LCP scrap (runners, prototypes) into regrind for non-critical parts (e.g., packaging), cutting waste by 15%. Our electric presses use 30% less energy than hydraulic machines, reducing our carbon footprint. We also offer halogen-free LCP grades for eco-friendly applications.​

5. 24/7 Support & Collaboration​

• 24/7 Engineering Support: Our LCP experts are available 24/7 to troubleshoot issues (e.g., warpage, short shots) and adjust processes—minimizing production downtime. We also provide real-time production data (via our customer portal) so clients can track orders.​

Collaborative Development: For new product launches (e.g., 6G components, next-gen medical devices), we work with clients from concept to production—providing material selection advice, mold design input, and performance testing. This collaborative approach ensures the final part meets all requirements on the first try.

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